Production of Printed Circuit Boards - production parameters
Type of laminate: | Aluminum pcb, FR-4(1-12 warstw),HDI,FPC,Rigid Flex |
Thickness of laminate: | 0,01 - 0,20 inches |
Thickness of copper: | 1/3oz-8oz |
Maximum size of the boards: | 17,72 *47,24 inches |
Minimum production format: | 0,16 -0,16 inches |
Minimum distance between tracks: | 3mil |
Quantity of layers: | 12 |
Heat conductibility: | Aluminum pcb 0.8-4.0W/m·K |
Final copper thickness on the external layers [µm]: | 8oz |
Final copper thickness on the internal layers [µm]: | 5oz |
Colour of the antisoldering mask from the element's side (TOP): | black, white, red, yellow, green, blue, purple, coffee |
Colour of the antisoldering mask from the soldering side (BOT): | black, white, red, yellow, green, blue, purple, coffee |
Description colours from the element's side (TOP): | black, white, red, yellow, green |
Description colours from the soldering side: | black, white, red, yellow, green, blue, purple, coffee |
Gold, HAL covering: | |
Soldering: | leaded soldering, unleaded Hasl, gold electrolytic, tin electrolytic submersion, electrolytic silver, OSP (Organic Solderability Preservative), colophony, blue adhesive |
Mechanical treatment: | milling, gravering, blind vias, beveling |
Final minimum of the aperture diameter [mm]: | 12:1 |
Minimum distance between tracks: | 3mil |
Minimum annulus [mils]: | HDI single side 0,01 inch |
Addendums: | detachable mask , UL certificate，ISO14001, TS16949 |
Documentation: | protel99se pads dxp P-cad2006 AutoCad |